Ethernet over Copper and EFM

Zhone delivers seamless LAN-to-WAN Ethernet convergence

Martin Sten “Using Zhone EtherXtend with both E1 and SHDSL lines has enabled delivery of higher bandwidth Ethernet business services in Finland over existing copper lines, thereby creating new and profitable Ethernet business services by re-using existing plant.”

—Martin Sten, Founder, Netmedia, Finland

Applications

Market studies show that more than 86% of businesses today are still served by copper. As services and networks moves to all-IP, there is growing demand for end-to-end connectivity from LAN to WAN for business services.

With the cost to lease a UNE-P being a fraction that of a UNE-L T1, many CLEC’s, local municipalities and utilities are discovering the benefits of Ethernet over Copper and Loop Bonding. By using easy to install Ethernet Access Device (EAD) coupled with cost-effective Ethernet Aggregation, a UNE-P can be transformed into a 5.7 Mbps. Ethernet connection, with multi-pair loop bonding increasing bandwidth to over 45 Mbps.

Another benefit of Ethernet over Copper is its simplicity and ease of deployment, not to mention less costly equipment requirements. It delivers IP services or Ethernet over TDM using native Ethernet rather than the more complex means using MPLS tunnels or MLPPP. Ethernet over copper delivers Transparent LAN Services (TLS) and can be installed quickly, turned up easily, and delivers bandwidth and quality equivalent to fiber.

Ethernet over Copper is used in carrier networks for business services ranging from T1/E1 to SHDSL and DS3 rates. It has strong popularity for cellular backhaul from remote cell sites to central switching centers. And it is often used by local and municipal agencies for such applications as traffic monitoring, and security or surveillance. Likewise, utilities find it ideal for connecting stations and monitoring sites along a right-of-way.

Solution: MALC-EFM , EtherXtend, EtherXtend LT and Network Extenders

In 2006, the industry adopted new 802.3ah EFM standards. Prior to the standard, there was several interim standard means of performing Ethernet over Copper Loop Bonding. Zhone has been a pioneer and leader in this area, supplying the world Ethernet over Copper technologies for more than 8 years with proven, reliable products

The MALC-EFM is an Ethernet Aggregation platform based on Zhone’s leading BLC architecture. MALC-EFM offers both T1/E1 and SHDSL.bis Ethernet line cards that can perform bonding of copper pairs. SHDSL.bis is another relatively new standard providing 5.7 Mbps. rather than older 2.3 Mbps. of bandwidth. Zhone is among the first access vendors offering SHDSL.bis Ethernet aggregation.

The MALC-EFM SHDSL.bis line card is 802.3ah EFM compliant, but also incorporates the legacy Ethernet over Copper interface as well, making it both backwards and forwards compatible. The T1/E1 line card version is based on the original standard. Zhone therefore supports is large existing customer base as well as new EFM-compliant deployments, offering a complete migration plan for service providers worldwide.

Zhone's Ethernet Solutions

Zhone offers a full range of Ethernet Access Devices (EAD’s) for a variety of applications and economics. EtherXtend is an advanced, intelligent EAD based on 802.3ah EFM standards, but also supporting the original standard as well. EtherXtend LT is offered in SHDSL.bis or DS3 versions, has fewer WAN and LAN ports as EtherXtend, and supports the original Ethernet over Copper standards. Zhone also offers a time-tested and proven TNE (T1), ENE (E1), and SNE (SHDSL) line of Ethernet Network Extenders.

Zhone is the only company today offering both Ethernet Aggregation in access and a full line of EAD devices. In keeping with Zhone’s philosophy, it delivers a complete end-to-end solution rather than only parts of the solution, ensuring performance and interoperability are never and issue.

Features

  • Standards compliant: MALC-EFM SHDSL.bis and EtherXtend CPE are IEEE 802.3ah EFM compliant. SHDSL bonding is compliant to HDLC, and T1/E1 to 2Base-TL specifications.
  • Bonded copper bandwidth: 5.7 Mbps SHDSL.bis bonding can deliver up to 45 Mb/s of bandwidth, with T1/E1 up to 12 or 16 Mb/s respectively.
  • Layer 2 and layer 3: Both bridging and routing is supported, along with 801.p and 802.1Q-inQ VLANs
  • Performance enhancements: Zhone delivers high perfomance over copper with low latency, low BER, low jitter and hitless operation designed into its EAD solutions.
  • Aggregation or bookend: Zhones offers the flexibility to deploy EAD's as a bookend, or terminate EAD's directly onto MALC-EFM line cards for high density Ethernet Aggregation.
  • IP SLA: MALC and EtherXtend supports IP SLA to enhance business services through performance monitoring and reporting.
  • Port densities: Zhone EtheXtend and Network Extender EAD families come in a wide range of LAN and WAN port densities - from single WAN ports up to 8, and single LAN ports up to 4 to offer the most economic solution for the service need.

Zhone Value Proposition and Benefits

MALC-EFM aggregation and EAD’s provide a cost-effective solution for delivering Ethernet business services as an alternative to traditional TDM or MPLS type services. Zhone’s proven Ethernet Over Copper loop bonding technologies can deliver fiber-like bandwidth and quality over existing copper. Pre-configured, easily installed EAD’s saves time and money for a service provider and its business customer alike. Creating services based on seamless LAN to WAN IP connectivity with native Ethernet creates new service and revenue opportunities such as Transparent LAN Service (TLS).


Zhone's Single Line Multi-Service architecture (SLMS™), allows carriers to concurrently deliver voice, new premium data and video services over copper or fiber access lines.
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